OptoTEC™ MBX Series
Supports high-temperature applications with compact geometric space constraints
The MBX Series of micro thermoelectric coolers support high-temperature applications with compact geometric space constraints.
MBX delivers precise temperature stabilization under changing environmental conditions.
The MBX Series offers micro footprints as small as 1.5 x 1.1mm with thicknesses down to 0.65mm.
The packing fraction for thermoelectric materials enables high heat pumping densities up to 43 W/cm2
at lower operating currents than traditional thermoelectric coolers.
Read OptoTEC MBX Series Test Protocol
Features
- Miniature footprints
- Precise temperature control
- Reliable solid-state operation
- Operates in high-temperature applications
- No sound or vibration
- RoHS-compliant
Solder Construction
Model |
Solder Type |
Melt Temp |
MBX |
(SnSb) Tin Antimony |
232°C |
HBX |
(AuSn) Gold Tin |
280°C |
Ceramic Materials
Ceramic Material |
Thermal Conductivity |
Option |
(ALO) Alum Oxide |
24 W/mK |
F2 |
(ALN) Alum Nitride |
170 W/mK |
F2N |
Surface Finish Options*
Solder Type |
Melt Temp |
Option |
Au plating (Hot/Cold Surface) |
|
GG |
Non-Metallized Hot and/or Cold face |
|
11 |
Pre-tinning Hot and/or Cold face with 118˚C InSn Solder |
118˚C |
22 |
Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder |
138˚C |
33 |
|
|
|
Lead Attachment
Solder Type |
Option |
Au plated pads |
W0 |
Au plated Posts |
WP |
Custom Options*
|
|
|
|
NTC Thermistor |
Au Plated Posts |
Ceramic Metallization Patterning |
Hermetic Sealing |
* In general these products are highly customized to optimize CoP and footprint constraints.
Please contact our sales team to discuss your specific application requirements.
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Miniature Thermoelectric Coolers for Butterfly Packages
* Any information furnished by Laird Thermal Systems and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.
Sales and Support Centers
Asia/Pacific: +86 755 3698 8333 x218
Americas: +1 919-597-7300
EMEA (DE): +49 8031 6192887
EMEA (SE): +46 31 7046757
EMEA (CZ) +420 488 575 111